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World's Smallest
High-Performance
COM Express Module
At the size of a business card (55 x 84 mm) and supporting a Freescale QorIQ quad-core P2041 processor, the mini form factor XPedite5650 is the smallest and among the highest performing COM Express modules available.
Designed and tested for the harshest military, aerospace, and industrial environments, the XPedite5650 is a rugged and reliable COTS processor mezzanine solution that includes enhancements above and beyond commercial COM Express modules:
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Soldered-down memory replaces less rugged/reliable SO-DIMMs
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Includes additional mounting holes for increased structural integrity
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Designed and tested for operation from -40 to +85ºC
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Provides extended shock and vibration capabilities for operation in harsh environments
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Conduction-cooled and air-cooled applications supported by a single design
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Incorporates the same design and manufacturing principles as all X-ES Level 5 rugged products
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Utilizes tin-lead manufacturing process to mitigate tin-whisker effects (RoHS-compliant process is also available)
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Provides BIT support
To support XPedite5650 and all COM Express development, X-ES provides the versatile CX-DP COM Express development platform. It provides a convenient ATX desktop setup with standard I/O connectors for COM Express I/O. Additionally, the CX-DP is an XPand6000 Series development platform with support for all of the functionality of the XPand6000 Series, including a PMC or XMC and an SSD.
About X-ES
Extreme Engineering Solutions, Inc. (X-ES), a 100% U.S.A.-based company, designs and builds single board computers, I/O boards, power supplies, backplanes, chassis, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service.
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