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X-ES Rugged Small Form Factor Solutions
Rugged SFF Systems
With minimal SWaP and conduction-cooling or natural convection-cooling, the XPand6000 Series -based systems provide both high performance processing capabilities and a multitude of I/O functionality, added via PMCs/XMCs. 

XPand6000 Series features: 
- Single rugged COM Express module
- Single conduction-cooled PMC/XMC
- Optional 1.8" or Slim SATA SSD 
MIL-STD-704 28V DC p/s &
   MIL-STD-461 E/F EMI filtering
- Environmentally sealed
- D38999 connectors

- Natural convection-cooling
- 2.36 in. (W) x 4.88 in. (H) x
  7.10 in. (L)

- Weighs less than 4 lbs.

- Natural convection-cooling
- 4.88 in. (W) x 2.10 in. (H) x
  7.70 in. (L)
- Weighs less than 3.75 lbs.

- Conduction-cooling
- 4.88 in. (W) x 1.90 in. (H) x
   7.70 in. (L)

- Weighs less than 3.5 lbs.

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SFF Systems for SWaP Limited Applications

Does your application have severe SWaP constraints and ruggedization requirements, yet still require significant CPU performance? X-ES has a solution targeted directly at these applications – a Small Form Factor (SFF) system taking less space than 79 cubic inches, weighing less than 3.5 lbs., and supporting a dual-core QorIQ processor. X-ES SFF systems are designed, manufactured, and tested to satisfy the most demanding military applications and can be bolted to almost any available surface on a small AUV or ground vehicle.

The X-ES SFF systems are based on the
XPand6000 Series of rugged SFF enclosures and utilize COTS components. The processing power is provided by the conduction-cooled XPedite5550, a COM Express module with processing options ranging from a single-core 800 MHz Freescale QorIQ P1011 processor (at <4.5W) to a dual-core 1.2 GHz QorIQ P2020 processor (at 8W). The I/O can be tailored via a COTS conduction-cooled PMC or XMC module to provide I/O such as MIL-STD-1553, ARINC 429, CANbus, additional Ethernet, serial, GPIO, A/D, D/A, camera interfaces, video, etc. Optional storage can be integrated via a 1.8” or Slim SATA Solid State Disk (SSD) memory module.

XPedite5550 features include:
  • COM Express Compact form factor (95mm x 95mm)
  • COM Express Enhanced Type 5 pinout
  • Conduction- and air-cooled versions that support -40 to +85ºC
  • Freescale QorIQ P1011, P1020, P2010, and P2020 processors
  • Up to 8 GB of DDR3-800 SDRAM memory
  • x2 and x1 PCI Express interfaces
  • Three Gb Ethernet ports, two SATA 3.0 Gb/s ports, two serial ports, and a USB 2.0 port
  • Linux, INTEGRITY and VxWorks BSPs available

About X-ES
Extreme Engineering Solutions, Inc. (X-ES) designs and builds chassis, single-board computers, I/O, power, backplanes, system-level and custom products within the embedded computer industry. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service. Please contact X-ES sales if you have any questions.

Extreme Engineering Solutions, Inc
3225 Deming Way, Suite 120, Middleton, WI 53562
+1-608.833.1155 | xes-inc.com | sales@xes-inc.com

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